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Ceramic Resin Hybrid Materials

Features and applications of ceramic resin hybrid materials

Antenna in Package (AiP)

We make AiP. The antenna is integrated into a package along with the radio-frequency integrated circuit.

Flexible Circuit

We make flexible circuits with inkjet printing process.

They can make previously impossible designs possible. 

Flexible Circuit

Flexible circuits can fit into a mobile device of narrow space

because a 90-degree bending is possible.

Photolithography vs. Additive Process

Additive manufacturing by inkjet printing can reduce the loss of expensive materials by using them only on the place where they are needed.

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